Effect of Surface Cleaning Process on the Wafer Bonding of Silicon and Pyrex Glass

Abstract Anodic bonding is a reliable packaging method for MEMS devices, and the surface properties of wafer directly affect efficiency. Therefore, treatment to be bonded necessary. Herein, effects three different cleaning processes (degreasing, piranha solution RCA solution) on were investigated by atomic force microscopy, scanning electron infrared spectroscopy, anodic experiments. The analysis showed that during solution-cleaned Pyrex glass, interface was more closely attached, best obtained. experiments glass current increased with applied voltage, time decreased accordingly. This most evident in case cleaning. SEM images as voltage increased, became uniform without obvious voids. Due influence strong electric field temperature field, an irreversible chemical reaction occurred at interface, which formed layer key successful bonding.